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主要技术参数/MAIN TECHNICAL PARAMETERS
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X、Y轴可移动范围
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X、Y-axis movable range
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X:300mm Y:300mm
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Z、R轴可移动范围
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Z、R-axis movable range
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Z:50mm R:360°
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速度
动作
Dynamic
For
Speed
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X、Y轴PTP
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Degree of X.Y-axis PTP
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5-500mm/ses
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Z 轴PTP
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Z-axis PTP
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2.5-250mm/ses
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R 轴PTP
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R-axis PTP
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6-600°/ses
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X、Y 轴CP
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X.Y-axis CP
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0.1-500/ses
|
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Z 轴CP
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Z-axis CP
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0.1-300/ses
|
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记忆容量
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Memory capacity
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32MB
|
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小分析度
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Analysis of degree
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0.01mm
|
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重复精度
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Repeat accuracy
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±0.02mm
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重量
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Weight
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约75kg
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耗电量
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Consumption
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约0.5kw
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空气压力
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Air pressure
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4-5kg/C㎡
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适用锡丝范围
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The scope of application of solder wire
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0.6mm-1.2mm
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焊锡参数
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Solder parameter optional
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任选
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温度设定范围
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Temperature setting range at room temperature
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常温-450℃
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锡丝送锡位置
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Tin tin wire position can be sent to debug
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可调试
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15
